As part of the French Recovery Plan, Teledyne e2v Semiconductors and Safran Electronics & Defense have jointly obtained a French state aid to develop their System-in-Package roadmap

0

GRENOBLE, FRANCE – Media OutReach – 18 June 2021 – Teledyne e2v Semiconductors (Grenoble) and Safran Electronics & Defense (Valence), are currently launching the CORAIL SiP (System-in-Package) project with a significant state aid from the French government. The CORAIL SiP project was created to accelerate investments in order to boost the new electronic sector for System-in-Package in France.