Teledyne e2v and Infineon partner on optimized processor boot solution for high reliability edge computing Space systems

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MUNICH, GERMANY AND GRENOBLE, FRANCE – Media OutReach – 14 July 2023 – Infineon Technologies (FSE: IFX / OTCQX: IFNNY) and Teledyne e2v (NYSE:TDY) have developed a reference design for the implementation of compute-intensive space systems. The design, built around a Teledyne e2v QLS1046-Space edge computing module, which is configured by the radiation-hardened 64MByte Infineon SONOS based NOR Flash memory, enables high performance space processing applications. The reference design addresses two inherent challenges in space endeavors: weight and communication limitations. By reducing the number of components in the computing system and enabling computation at the edge, it helps to decrease latency and overcome communication restrictions.