High-accuracy packaging in panel level packaging
TOKYO, JAPAN – Media OutReach Newswire – 27 March 2025 – Toray Engineering Co., Ltd.,has developed the UC5000, a high-accuracy semiconductor packaging equipment (bonder) for panel level packaging “PLP”. PLP is an advanced semiconductor packaging technology, for which there is growing demand particularly from AI servers. Sales of the UC5000 will commence in April 2025.
