Leveraging Infineon’s automotive system understanding and SiC product offerings, and Foxconn’s capability in system-level integration, electronics design and manufacturing expertise.
Jointly establish a system application center in Taiwan to further expand the scope of their cooperation.
MUNICH, GERMANY AND TAIPEI, TAIWAN – Media OutReach – 10 May 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), the global leader in automotive semiconductors, and Hon Hai Technology Group (“Foxconn”) (TWSE:2317), the world’s largest electronics manufacturing services provider, aim to establish a long-term partnership in the field of electric vehicles (EV) to jointly develop advanced electromobility with efficient and intelligent features. The Memorandum of Understanding (MoU) focuses on silicon carbide (SiC) development, leveraging Infineon’s automotive SiC innovations and Foxconn’s know-how in automotive systems.
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