Panel Level Coater for Advanced Semiconductor Packaging
HONG KONG SAR – Media OutReach Newswire – 9 December 2024 – Toray Engineering Co.,Ltd has developed the “TRENG-PLP Coater”, a high-accuracy coating device for panel level packaging (PLP is an advanced semiconductor packaging technology) for which there is growing demand particularly from AI servers and data centers. Sales of the Coater will commence in December 2024.
