Vertiv™ CoolChip CDU 2300 and Vertiv™ CoolChip Fluid Network Row Manifolds to be showcased at Datacloud Global Congress
Johannesburg, South Africa [May, 2026] – Vertiv (NYSE: VRT), a
global leader in critical digital infrastructure, infrastructure, today
announced the expansion of its end-to-end thermal chain with the
availability of the Vertiv™ CoolChip CDU 2300 [1] and Vertiv™
CoolChip Fluid Network Row Manifolds [2] in Europe, Middle East and
Africa (EMEA). These liquid cooling technologies support the growing
demands of AI and high-density, next-generation compute to help
customers deploy high-density infrastructure faster and operate more
efficiently.
The Vertiv CoolChip family is a core building block of the Vertiv
thermal chain, an end-to-end portfolio including direct-to-chip cooling,
immersion cooling, rear-door heat exchangers, coolant distribution, heat
rejection, intelligent controls, and lifecycle services into a single,
cohesive thermal management system.
The newly announced solutions will be on display at Datacloud Global
Congress in Cannes [3] (June 1–4), where Vertiv will participate as a
Patron Sponsor and showcase its latest technologies at booth n. 123.
“The rapid growth of AI workloads is driving a fundamental shift in
how data centres are designed, cooled, powered and operated,” said
Paul Ryan, president for EMEA at Vertiv. “At Datacloud Global
Congress, we’re showing how Vertiv is expanding its end‑to‑end
portfolio, combining high-density power solutions, liquid cooling, heat
rejection, intelligent controls, and lifecycle services, to help
customers deploy AI-ready infrastructure faster and operate more
efficiently over time.”
As a critical link in the Vertiv™ thermal chain, the Vertiv CoolChip
CDU 2300 is a liquid-to-liquid coolant distribution unit delivering 2.3
MW of cooling capacity in a compact footprint, offering one of the
highest capacity-to-footprint ratios available in the market.Its smaller
cabinet supports flexible placement, including in‑row or in adjacent
mechanical areas, helping operators reduce floor space requirements and
the number of CDUs needed in large‑scale, high‑density deployments.
Vertiv™ CoolChip CDU systems span from 100 kW to 2.3 MW and support
direct‑to‑chip liquid cooling as well as rear‑door heat
exchangers. The integrated Vertiv™ CoolChip CDU controller allows
temperature and flow to adapt to workload demands, while features such
as redundancy, unit‑to‑unit communication, and remote monitoring
help enhance system availability and simplify operations. This
controller-level intelligence enables the CDU to operate in coordination
with other elements of the thermal chain, enabling consistent thermal
performance across the entire infrastructure.
Complementing the CDU within the thermal chain architecture, the new
Vertiv™ CoolChip Fluid Network Row Manifolds provide the physical
connectivity layer between coolant distribution units, server-level
cooling hardware, and heat rejection systems. Each manifold assembly is
flushed, passivated, pressure-tested, and sealed to deliver superior
cleanliness, corrosion resistance, and leak-free performance. The
configurable design provides full system compatibility across
direct-to-chip cooling, immersion cooling, and rear-door heat exchangers
while simplifying coolant routing. It also enables fast deployment for
new builds or retrofits, helping operators scale liquid-cooling
infrastructure in weeks rather than months.
Vertiv complements its portfolio with Vertiv™ Liquid Cooling Services
[4], covering design support, installation, and ongoing maintenance.
This lifecycle approach is designed to help customers maximise
efficiency, maintain system availability, and support consistent
performance as liquid cooling becomes an integral part of modern data
centre operations.
Vertiv experts will be available throughout Datacloud Global Congress at
booth #123 to discuss Vertiv’s end‑to‑end portfolio of power,
cooling, and converged infrastructure solutions designed to support
high‑density, AI‑ready data centres. Explore insights and resources
at Vertiv.com/AI [5].
To schedule a meeting with Vertiv experts at Datacloud Global Congress,
click here [6].
About Vertiv
Vertiv (NYSE: VRT) brings together hardware, software, analytics and
ongoing services to enable its customers’ vital applications to run
continuously, perform optimally and grow with their business needs.
Vertiv solves the most important challenges facing today’s data centers,
communication networks and commercial and industrial facilities with a
portfolio of power, cooling and IT infrastructure solutions and services
that extends from the cloud to the edge of the network. Headquartered in
Westerville, Ohio, USA, Vertiv does business in more than 130 countries.
For more information, and for the latest news and content from Vertiv,
visit Vertiv.com [7].
Forward-Looking Statements
This release contains forward-looking statements within the meaning of
the Private Securities Litigation Reform Act of 1995, Section 27 of the
Securities Act, and Section 21E of the Securities Exchange Act. These
statements are only a prediction. Actual events or results may differ
materially from those in the forward-looking statements set forth
herein. Readers are referred to Vertiv’s filings with the Securities and
Exchange Commission, including its most recent Annual Report on Form
10-K and any subsequent Quarterly Reports on Form 10-Q for a discussion
of these and other important risk factors concerning Vertiv and its
operations. Vertiv is under no obligation to, and expressly disclaims
any obligation to, update or alter its forward-looking statements,
whether as a result of new information, future events or otherwise.










